Thermal analysis of chip on board packaging of high power led's with heat pipe using cfd for street lights

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dc.authoridSahin, Necmettin -- 0000-0002-5756-4216
dc.contributor.authorÇiçek, Burcu
dc.contributor.authorŞahin, Necmettin
dc.contributor.authorAlkan, Mahmut
dc.date.accessioned13.07.201910:50:10
dc.date.accessioned2019-07-16T09:17:24Z
dc.date.available13.07.201910:50:10
dc.date.available2019-07-16T09:17:24Z
dc.date.issued2018
dc.departmentMühendislik Fakültesi
dc.description.abstractIn this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined.
dc.identifier.endpage1244en_US
dc.identifier.issn2147-1762
dc.identifier.issue4en_US
dc.identifier.scopusqualityQ2
dc.identifier.startpage1229en_US
dc.identifier.urihttps://hdl.handle.net/20.500.12451/4745
dc.identifier.volume31en_US
dc.identifier.wosWOS:000452028700019
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.indekslendigikaynakTR-Dizin
dc.language.isoen
dc.publisherGazi Üniversitesi
dc.relation.ispartofGazi University Journal of Science
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectHigh Power Led
dc.subjectCFD
dc.subjectHeat Pipe
dc.subjectThermal Analysis
dc.titleThermal analysis of chip on board packaging of high power led's with heat pipe using cfd for street lights
dc.typeArticle

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